Intrinsic stress analysis of tungsten-lined open TSVs
نویسندگان
چکیده
منابع مشابه
Stress evolution in the metal layers of TSVs with Bosch scallops
We have studied the stress evolution in the tungsten film of a particular open TSV technology during the thermal processing cycle. The film is attached to the via’s wall, where scallops were observed as a result of the Bosch processing. Our work describes a scheme which considers the scallops on the TSV and conjugates a stress model for thin-films with the traditional mechanical FEM approach. T...
متن کاملProcess and Performance of Copper TSVs
The difference between the performance of TSVs manufactured using SF6/O2 plasma etching or a Bosch process is explored through simulations. The geometric ratio of the sample TSV is approximately 5μm:58μm. The electrical performance of the devices is explored through capacitance and resistance extraction, while the reliability is analyzed using thermo-mechanical and electromigration simulations ...
متن کاملExperimental measurement of the effect of copper through-silicon via diameter on stress buildup using synchrotron-based X-ray source
In this work, the effect of copper through-silicon via (TSV) interconnect diameter on stress buildup in Cu TSVs was experimentally determined using a synchrotron-based X-ray microdiffraction technique. A single chip with different Cu TSV diameters (3, 5, and 8 lm), all having the same depth and processing conditions was studied. Prior to the measurements, the chip was annealed at 420 C (30 min)...
متن کاملMethodology for analysis of TSV stress induced transistor variation and circuit performance Citation
As continued scaling becomes increasingly difficult, 3D integration with through silicon vias (TSVs) has emerged as a viable solution to achieve higher bandwidth and power efficiency. Mechanical stress induced by thermal mismatch between TSVs and the silicon bulk arising during wafer fabrication and 3D integration, is a key constraint. In this work, we propose a complete flow to characterize th...
متن کاملInvestigating the Effect of Joint Geometry of the Gas Tungsten Arc Welding Process on the Residual Stress and Distortion using the Finite Element Method
Although a few models have been proposed for 3D simulation of different welding processes, 2D models are still more effective in design goals, thus more popular due to the short-time analysis. In this research, replacing "time" by the "third dimension of place", the gas tungsten arc welding process was simulated by the finite element method in two dimensions and in a short time with acceptable ...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید
ثبت ناماگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید
ورودعنوان ژورنال:
- Microelectronics Reliability
دوره 55 شماره
صفحات -
تاریخ انتشار 2015